The company plans to invest around 80 billion yen (around £640m) in new wafer processing equipment used to make stacked CMOS image sensors at its plant in Nagasaki, Japan.

‘With this development, Sony plans to increase total production capacity for CCD and CMOS image sensors to approximately 60,000 wafers per month by the end of September 2013,’ the firm announced today in a statement.

Sony says the move comes in the wake of ‘rapidly expanding demand for smartphones and tablets’.